Method and system for fabricating semiconductor components

A method for fabricating a semiconductor component comprising:

• providing a semiconductor die;
• providing a substrate comprising silicon or ceramic;
• providing an adhesive tape with a width;
• providing a tape cutter apparatus configured to cut the tape to form a decal with a first finished dimension equal to the width of the tape and a second finished dimension equal to an indexed length of the tape;
• forming the decal using the tape cutter apparatus;
• attaching the decal to the substrate;
• and
• attaching the die to the decal to attach the die to the substrate.

A method for fabricating a semiconductor component comprising:

• providing a semiconductor die;
• providing a substrate comprising an insulating material;
• providing an adhesive tape with a width;
• providing a tape cutter apparatus comprising an opening configured to receive the tape and a cutter configured to move through the opening to cut the tape;
• indexing a length of the tape into the opening;
• cutting the length of the tape with the cutter to form a decal with a first finished dimension equal to the width of the tape and a second finished dimension equal to the length of the tape;
• applying the decal to the substrate;
• and
• attaching the die to the decal to attach the die to the substrate.

A method for fabricating a semiconductor component comprising:

• providing a semiconductor die;
• providing a substrate comprising an insulating material;
• providing an adhesive tape with a width;
• providing a tape cutter apparatus comprising a base, an opening in the base configured to receive the tape, and a cutter configured to move through the opening to cut the tape;
• indexing a length of the tape into the opening;
• following the indexing step, cutting the length of the tape using the cutter to form a decal with a first finished dimension equal to the width of the tape and a second finished dimension equal to the length of the tape;
• aligning and locating the decal with respect to the substrate using an alignment and location of the opening with respect to the substrate;
• attaching the decal to the substrate;
• and
• attaching the die to the decal to attach the die to the substrate.

A method for fabricating a semiconductor component comprising:

• providing a semiconductor die;
• providing a substrate comprising a polymer material;
• providing an adhesive tape having a width;
• providing a tape cutter apparatus comprising a base, an opening in the base configured to receive the tape, and a cutter configured to move through the opening to cut the tape;
• indexing a length of the tape into the opening;
• positioning a die attach area of the substrate proximate to the opening;
• cutting the tape by extending the cutter through the opening to form a decal having a first finished dimension equal to the width of the tape and a second finished dimension controlled by the indexing step;
• applying the decal to the die attach area using an alignment and location of the opening relative to the die attach area to align and locate the decal;
• and
• attaching the die to the decal to attach the die to the substrate.