Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
AssigneeAptos Corporation
InventorsChung W Ho, Tsing-Chow Wang
Life of this patent
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Abstract
Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.
Claims12
A method for forming a solder interconnection structure comprising:
- providing a substrate having formed thereover a bond pad;
- forming upon the bond pad a first solder interconnection layer;
- forming over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer;
- forming over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.
A method for forming a solder interconnection structure comprising:
- providing a substrate having formed thereover a bond pad;
- forming upon the bond pad a first solder interconnection layer;
- forming over the first solder interconnection layer a copper layer;
- oxidizing the copper layer at least partially to form a copper oxide layer;
- etching anisotropically, while employing an anisotropic etch method, the copper oxide layer to form an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer;
- forming over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.
Dependencies are inferred from the claim text.