Probe points for heat dissipation during testing of flip chip IC
AssigneeAdvanced Micro Devices, Inc.
InventorsRama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring
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Abstract
According to one aspect of the disclosure, the present invention provides methods and arrangements for testing a flip chip semiconductor device after the back side of the chip has been thinned to expose a selected region in the substrate. For some chips, thinning removes substrate material useful for drawing heat away from the internal circuitry when the circuitry is running at high speeds. To compensate for this material loss, as plurality of thermally conductive elements is formed in the backside of the semiconductor to draw heat from the backside of the device when the semiconductor device is activated.
Claims21
A method for testing a semiconductor device having a circuit side and a back side in the substrate, the method comprising:
- thinning the semiconductor device and exposing a selected region in the semiconductor device at its back side;
- forming a plurality of thermally conductive elements in the backside of the semiconductor device to facilitate testing via its circuit side;
- and
- activating the semiconductor device while using the thermal conductive elements to dissipate heat generated by the semiconductor device during a test procedure.
A method for dissipating heat in a semiconductor device, the device having a substrate with a backside and a circuit side with active devices thereon, comprising:
- forming a plurality of thermally conductive probes in the backside of the semiconductor device;
- and
- activating the semiconductor device while using the thermally conductive probes to dissipate heat generated by the semiconductor device.
A test arrangement for a semiconductor device having a circuit side and a back side, comprising:
- means for securing and testing the semiconductor device via the circuit side of the semiconductor device;
- means for conducting heat generated by the semiconductor device while activated, the conducting means being formed in the semiconductor device, and wherein the means for securing and testing is adapted to test the semiconductor device while the semiconductor device is activated.
An arrangement for testing a semiconductor device having a circuit side and a back side in the substrate, the arrangement comprising:
- means for thinning the semiconductor device and exposing a selected region in the semiconductor device at its back side;
- means for forming a plurality of thermally conductive elements in the backside of the semiconductor device to facilitate testing via its circuit side;
- and
- means for activating the semiconductor device while using the thermal conductive elements to dissipate heat generated by the semiconductor device during a test procedure.
Dependencies are inferred from the claim text.