Semiconductor device and method for manufacturing the same
AssigneeNiigata Seimitsu Co., Ltd.
InventorsKouichi Ikeda, Takeshi Ikeda
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Abstract
A semiconductor device which is mounted with a plurality of semiconductor chips. The fraction defective is low when the device is manufactured, and the efficiency of inspection is high. A method for manufacturing such a semiconductor device is also disclosed. A plurality of identical bare chips 1 for memory are COB-mounted on a substrate 2, and the surface of the substrate 2 mounted with the chips 1 is encapsulated with a resin 3. Then all the chips 1 mounted on the substrate 2 are inspected at once. Four-chip, two-chip, and one-chip memory modules 10 are produced by cutting the substrate 2 and combining bare chips 1 which are judged to be nondefective chips.
Claims4
A method for manufacturing the semiconductor device, comprising:
- a first step of implementing a plurality of identical semiconductor chips on a substrate,
- a second step of sealing said substrate of said plurality of identical semiconductor chips with a resin,
- a third step for quality inspection said respective semiconductor chips, and
- a fourth step of dividing one or a plurality of said semiconductor chips from others of said semiconductor chips on the substrate into a group on the basis of the result of said inspection.
Dependencies are inferred from the claim text.