Radiation-sensitive resin composition
AssigneeJsr Corporation
InventorsTakashi Chiba, Jun Numata
Life of this patent
Estimating the term…
Loading patent…
AssigneeJsr Corporation
InventorsTakashi Chiba, Jun Numata
Estimating the term…
A radiation-sensitive resin composition comprising (a) a resin represented by a copolymer of p-hydroxystyrene and t-butyl (meth)acrylate and a copolymer of p-hydroxystyrene and p-t-butoxystyrene, (b) a photoacid generator, and (c) a quaternary ammonium salt compound represented by tetramethylammonium adamantanecarboxylate, tetramethylammonium oxalate, tetraethylammonium pyruvate. The radiation-sensitive resin composition is capable of producing a rectangular resist pattern while preventing the top edge of the pattern from rounding, which is a big problem in microprocessing of design dimensions of about 0.20 μm with a thin film. The radiation-sensitive resin composition is highly sensitive to deep ultraviolet radiation, X-rays, and charged particle rays and exhibits excellent sensitivity, resolution, and the like.
A radiation-sensitive resin composition comprising:
Dependencies are inferred from the claim text.