Substrate with solder alloy for mounting electronic parts
AssigneeKabushiki Kaisha Toshiba
InventorKouichi Teshima
Life of this patent
Estimating the term…
Abstract
Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
Claims22
A substrate for mounting an electronic part, comprising:
- an electrically conductive bonding member provided on a substrate;
- and
- a bonding portion which is formed of a solder alloy on the electrically conductive bonding member, in which the solder alloy comprises a zinc component and a tin component and has a first layer at the interface of the electrically conductive bonding member and the bonding portion, and the content of the zinc component of the first layer is concentrated to approximately 70% by weight or more, wherein the content of an oxygen component of the solder alloy is 100 ppm or less.
A substrate on which an electronic part is mounted, comprising:
- an electrically conductive bonding member provided on a substrate;
- and
- a bonding portion connecting the electronic part with the electrically conductive bonding member of the substrate, the bonding portion being formed of a solder alloy on the electrically conductive bonding member, in which the solder alloy comprises a zinc component and a tin component and has a first layer at the interface of the electrically conductive bonding member and the bonding portion, and the content of the zinc component of the first layer is concentrated to approximately 70% by weight or more, wherein the content of an oxygen component of the solder alloy is 100 ppm or less.
A substrate for mounting an electronic part, comprising:
- an electrically conductive bonding member provided on a substrate;
- and
- a bonding portion which is formed of a metallic composition on the electrically conductive bonding member, in which the metallic composition comprises a zinc component and a tin component and includes a surface layer in which the zinc component is concentrated so that the content of the tin component is at most approximately 1% by weight, wherein the content of an oxygen component of the solder alloy is 100 ppm or less.
A substrate on which an electronic part is mounted, comprising:
- an electrically conductive bonding member provided on a substrate;
- and
- a bonding portion connecting the electronic part with the electrically conductive bonding member of the substrate, the bonding portion being formed of a metallic composition on the electrically conductive bonding member, in which the metallic composition comprises a zinc component and a tin component and includes a surface layer in which the zinc component is concentrated so that the content of the tin component is at most approximately 1% by weight, wherein the content of an oxygen component of the solder alloy is 100 ppm or less.
Dependencies are inferred from the claim text.