Multilayer product for printed circuit boards

A protected copper foil laminate comprising a copper foil layer having a first side and a second side,

• wherein the first side is covered by a dielectric layer of an epoxy resin-impregnated woven glass fiber body and the second side is covered by a multi-layer protective film,
• wherein the multi-layer protective film has (i) an outer surface consisting of a silicone polymer release composition which prevents adhesion of the film to the copper at high temperature and pressure laminating conditions, and (ii) an inner surface adjacent the copper foil layer, said inner surface having disposed uniformly thereon a solution of a pressure sensitive polysilicone polymer in an organic solvent from which the organic solvent is removed, and
• wherein after exposure of the copper foil laminate to a temperature of at least 300° F. and a pressure of at least 300 psi, no pressure sensitive silicone polymer transfers to the copper foil layer.