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US 6,280,794 B1Granted
Method of forming dielectric material suitable for microelectronic circuits
AssigneeConexant Systems, Inc.
InventorsKing-Ning Tu, Yuhuan Xu, Bin Zhao
Life of this patent
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Abstract
An improved dielectric material having pores formed therein and a method for forming the material are disclosed. The material is formed of a polymer. Pores within the polymer are formed by forming solid organic particles within the polymer and eventually vaporizing the particles to form pores within the polymer.
Claims20
A method of forming a dielectric material, the method comprising the steps of:
- forming a mixture of a thermoset precursor and a dissolved sacrificial organic material;
- exposing the mixture to an environment configured to decompose the sacrificial organic material;
- and
- exposing a remaining mixture to an environment configured to cure the remaining mixture.
1 more element
A method of forming a material suitable as a dielectric material for a microelectronic circuit, the method comprising the steps of:
- forming a first mixture of a first solvent and a thermoset precursor;
- forming a second mixture of a second solvent and a sacrificial organic material dissolved therein;
- mixing said first and second mixtures to form a liquid compound;
- applying the liquid compound to a substrate surface;
- exposing the liquid compound to a process configured to evaporate said first and second solvents to form a condensed compound;
- exposing the condensed compound to an environment configured to cause the sacrificial organic material to decompose;
- and
- exposing the condensed compound to an environment configured to cause said thermoset material to cure.
5 more elements
A method of forming a dielectric material, the method comprising the steps of:
- forming a mixture of a thermoset precursor and a sacrificial organic material precursor;
- exposing the mixture to an environment configured to form sacrificial organic material from the organic material precursor;
- exposing the mixture to an environment configured to decompose the sacrificial organic material;
- and
- exposing a remaining mixture to an environment configured to cure said remaining mixture.
2 more elements
Dependencies are inferred from the claim text.