Compliant bond structure for joining ceramic to metal
AssigneeApplied Materials, Inc.
InventorsAnanda H. Kumar, Kadthala R. Narendrnath, Shamouil Shamouilian
Life of this patent
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Abstract
A compliant bond structure 20 comprising wire mesh 25 strands 50 surrounded by compliant metal 40 is useful for bonding a ceramic surface 30 to a metal surface 35. The wire mesh 25 comprises interlocking strands 50 having longitudinal axes that are oriented substantially parallel to the ceramic and metal surfaces 30, 35. More preferably, the wire mesh 25 comprises strands having a coefficient of thermal expansion that is about 0.4 to about 1.6 times the average of the coefficients of thermal expansion of the metal and ceramic surfaces 30, 35.
Claims64
A support assembly capable of supporting a substrate in a process chamber, the support assembly comprising:
- (a) an electrostatic chuck comprising a ceramic having an electrode therein, the electrostatic chuck having an upper surface capable of receiving the substrate and a lower surface;
- (b) a support having a support surface capable of supporting the lower surface of the electrostatic chuck;
- and
- (c) a bond between the lower surface and the support surface, the bond comprising a wire mesh.
A support assembly capable of supporting a substrate in a process chamber, the support assembly comprising:
- (a) a ceramic having a surface;
- (b) a support having a support surface capable of receiving the surface of the ceramic;
- and
- (c) a bond between the ceramic surface and the support surface, the bond comprising a wire mesh in a metal.
A support assembly capable of supporting a substrate in a process chamber, the support assembly comprising:
- (a) an electrostatic chuck comprising a ceramic having an electrode therein, the electrostatic chuck having an upper surface capable of receiving the substrate and a lower surface;
- (b) a support having a surface capable of receiving the lower surface of the electrostatic chuck;
- and
- (c) a bond between the lower surface and the support surface, the bond comprising a wire mesh in a compliant material.
A support assembly capable or supporting a substrate in a process chamber, the support assembly comprising:
- (a) an electrostatic chuck comprising a dielectric and an electrode, the electrostatic chuck having a lower surface;
- (b) a support having a support surface capable of receiving the lower surface of the electrostatic chuck;
- and
- (c) a bond between the lower surface of the electrostatic chuck and the support surface, the bond comprising a wire mesh.
A process chamber capable of processing a substrate, the process chamber comprising:
- (a) an electrostatic chuck comprising a ceramic having an electrode therein, the electrostatic chuck having an upper surface capable of receiving the substrate, and the electrostatic chuck having a lower surface;
- (b) a support having a support surface capable of receiving the lower surface of the electrostatic chuck;
- (c) a bond between the lower surface of the electrostatic chuck and the support surface, the bond comprising a wire mesh;
- (d) a gas distributor capable of introducing process gas into the process chamber;
- and
- (e) a gas energizer capable of energizing the process gas.
A support assembly capable of supporting a substrate in a process chamber, the support assembly comprising:
- a surface capable of receiving the substrate;
- and
- a bond below the surface, the bond comprising a wire mesh in indium.
Dependencies are inferred from the claim text.