Reactor vessel having improved cup, anode and conductor assembly

A reactor vessel for electroplating a microelectronic workpiece, comprising:

• a reservoir container including a base plate and a surrounding container sidewall upstanding from said base plate, said reservoir container further including an exhaust ring supported on said container sidewall;
• a cup arranged above said base plate, said cup having a bottom wall and a surrounding cup sidewall upstanding from said bottom wall, said cup sidewall defining a level for an electroplating process fluid, said cup further comprising an outer wall surrounding said cup sidewall and fixed thereto, with intermittent gaps therebetween for the vertical passage of fluid, said outer wall having a first radial surface facing downwardly for being supported on a second radial surface of the exhaust ring facing upwardly, said exhaust ring being spaced from said outer wall to define an exhaust plenum therebetween, said outer wall having at least one inlet opening into said exhaust plenum and said exhaust ring having at least one outlet opening out of said plenum, said cup being supported around its perimeter on said surrounding container sidewall;
• an electrode plate arranged within said cup below said level;
• a tube sealed to said base plate and extending through said cup bottom wall to support said electrode plate from said base plate, said tube having a substantially closed bottom, and a top;
• and
• a conductor wire, arranged within said tube and passing through said tube bottom and top, said conductor wire having a plug electrically connected to said electrode plate.