Target misalignment detector
AssigneeApplied Materials, Inc.
InventorsSeh Kwang Lee, John Egermeier
Life of this patent
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Abstract
A method and apparatus for detecting target misalignment and plasma instability in a sputtering chamber in a semiconductor fabrication system is provided. In certain embodiments, a detector is utilized to monitor the voltage of the power applied to bias the target. If the voltage fluctuates excessively, plasma instability and target misalignment is indicated.
Claims43
A method of detecting target misalignment in a sputter deposition apparatus, comprising:
- applying power to bias said target;
- detecting fluctuations in said power being applied to said target;
- and
- providing a target misalignment indication signal as a function of said detected power fluctuations.
A method of detecting target misalignment in a sputter deposition apparatus, comprising:
- applying DC power to bias said target;
- detecting voltage fluctuations in said DC power being applied to said target;
- and
- providing a target misalignment indication signal as a function of said detected voltage fluctuations.
An apparatus for sputter depositing material from a target onto a workpiece, comprising:
- a chamber;
- a target supported by said chamber;
- a power supply having an output coupled to said target for providing a power signal to bias said target;
- and
- a detector coupled to said power supply output for providing a signal indicating target misalignment as a function of said power signal.
An apparatus for sputter depositing material from a target onto a workpiece, comprising:
- a chamber;
- a target supported by said chamber and having a surface which comprises a material adapted to be sputtered;
- a power supply having an output coupled to said target for providing a power signal to bias said target;
- and
- detector means coupled to said power supply output for providing a signal indicating target misalignment as a function of said power signal.
An apparatus for sputtering a layer of material onto a workpiece, comprising:
- a chamber;
- a target;
- a power supply having an output coupled to said target for providing a power signal to bias said target;
- and
- a detector coupled to said power supply output for measuring an amount of signal fluctuation.
A method for detecting misalignment of a target body in a sputter deposition chamber, comprising:
- applying power to bias said target body;
- forming a plasma in said chamber;
- detecting fluctuations in said power being applied to said target while maintaining said plasma;
- and
- providing a target misalignment signal as a function of said fluctuations.
Dependencies are inferred from the claim text.