Method of forming a printed circuit board
OwnerRobert L. Wilburinventor
Life of this patent
Estimating the term…
Abstract
A printed circuit board can be formed by a method that includes the step of cutting a circuit pattern out of a low cost plastic sheet material, and transferring the pattern onto a tape. The tape, with the pattern adhesively attached, is transferred onto a conductive film surface on a dielectric board. Thereafter, the tape is removed, leaving the pattern on the conductive film. An acid-etching step is performed on the exposed areas of the conductive film, after which the pattern is removed from the non-etched areas of the conductive film.
Claims5
A method of forming a printed circuit on a dielectric board comprising:
- a. cutting a circuit pattern out of a flexible sheet, wherein said sheet has a first contact adhesive on a first major face thereof;
- b. pressing a tape against a second major face of said pattern, wherein said tape has a second contact adhesive on the tape surface that is engaged with the pattern;
- c. pressing the tape and pattern against a conductive film on a dielectric circuit board, whereby said first contact adhesive secures the pattern to the conductive film;
- d. separating the tape from the pattern leaving the pattern on the conductive film;
- e. etching exposed areas of the conductive film, to form a conductive layer underneath the pattern;
- and
- f. removing the pattern from the conductive layer.
A method of forming a printed circuit on a dielectric board, comprising:
- a. applying a first contact adhesive to a first major surface of a flexible masking sheet;
- b. temporarily attaching the masking sheet to a glossy surface by bringing the adhesive surface of the sheet into engagement with the glossy surface;
- c. cutting a circuit pattern out of said masking sheet;
- d. removing areas of said masking sheet, leaving a pattern on the glossy surface;
- e. providing a tape having a second contact adhesive on one of the tape major surfaces;
- f. bringing the tape into contact with the pattern so that the second contact adhesive is engaged with the exposed surface of the pattern;
- g. lifting the tape and pattern off the glossy surface;
- h. providing a dielectric circuit board with a conductive film on a major surface of the board;
- i. transferring the tape and pattern to the circuit board by bringing the adhesive surface of the pattern into engagement with the conductive film;
- j. removing the tape from the pattern, leaving the pattern adhesively attached to the conductive film;
- k. etching the exposed areas of the conductive film, to form a conductive layer underneath the pattern;
- and
- l. removing the pattern from the conductive layer.
Dependencies are inferred from the claim text.