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US 6,280,295 B1Granted
Apparatus and method to polish a wafer using abrasive flow machining
AssigneesProMOS Technologies Inc., Mosel Vitelic, Inc.
InventorHsiao Che Wu
Life of this patent
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Abstract
An apparatus and method to polish a wafer using abrasive flow machining (AFM) is provided. Under a high-pressure condition, the wafer is polished by flowing abrasive media with high viscosity, on the wafer in order to planarize the wafer. Therefore, the polishing efficiency is higher, and the attained roughness is lower than the conventional method. In addition, the selectivity of this method is lower.
Claims18
An apparatus for polishing a wafer by flowing abrasive media on the wafer, which comprises:
- a table used for supporting the wafer disposed thereon;
- a carrier disposed on the table in an detachable manner;
- an abrasive media supply device, communicating with the carrier, used for supplying the abrasive media to a space defined by the carrier and the table;
- a pressure device, communicating with the carrier, used for applying pressure to the abrasive media inside the space;
- an abrasive media-removing device, communicating with the carrier, used for supplying high-pressure air to the space to remove the abrasive media inside the space
- wherein the abrasive media supply device further comprises:
- a first tube communicated with the carrier at one end;
- a first valve attached to the first tube;
- and
- a pump communicated with the other end of the first tube.
7 more elements
An apparatus for polishing a wafer comprising:
- a table supporting the wafer disposed thereon;
- a carrier detachably disposed on the table;
- a supply device communicating with the carrier and supplying abrasive media to a space defined by the carrier and the table;
- a pressure device communicating with the carrier and applying pressure to the abrasive media inside the space;
- and
- a removing device communicating with the carrier and supplying high pressure air to the space for removing the abrasive media inside the space.
3 more elements
A method for polishing a wafer comprising the steps of:
- disposing the wafer onto a table;
- detachably disposing a carrier onto the table;
- supplying abrasive media to a space defined by the carrier and the table;
- applying pressure to the abrasive media inside the space;
- and
- supplying high pressure air to the space for removing the abrasive media inside the space.
3 more elements
Dependencies are inferred from the claim text.