Polishing apparatus
AssigneeSony Corporation
InventorsShuzo Sato, Hiizu Ootorii, Takaaki Kozuki
Life of this patent
Estimating the term…
Abstract
A polishing wheel is pushed up and down in the Z-axis direction owing to a wafer surface shape. And the polishing amount depends on the height of protrusions on a wafer surface. Where a spindle is a rigid body in the Z-axis direction, the pressing force of the polishing wheel caused by vertical movement of a tool varies depending on the position on a wafer and hence polishing is not performed uniformly. To solve this problem, the spindle is provided with a Z-axis parallel leaf spring mechanism. Push-up and push-down actions of the polishing wheel are absorbed by displacement of the parallel leaf spring mechanism. This enables uniform polishing. Since the tool can be hardened, the flatness can also be improved.
Claims8
A polishing apparatus for polishing and finishing a workpiece so that the workpiece is made flat and uniform in height by pressing the workpiece being in contact with a surface of a table that is provided parallel with a horizontal surface by means of a polishing wheel that is opposed to the workpiece, comprising:
- a Z-axis slide for supporting the polishing wheel so that the polishing wheel is slidable in a Z-axis direction;
- a feed shaft for feeding the polishing wheel in the Z-axis direction;
- a Z-axis parallel leaf spring mechanism that is interposed between the Z-axis slide and the feed shaft for displacing a support side of the polishing wheel in accordance with working pressure.
A polishing apparatus, for polishing and finishing a workpiece so that the workpiece is made flat and uniform in height by pressing the workpiece being in contact with a surface of a table that is provided parallel with a horizontal surface by means of a polishing wheel that is opposed to the workpiece, comprising:
- a table damper mechanism for supporting the table that is mounted with the object.
A polishing apparatus in which a pad is struck to a rotary table that is provided parallel with a horizontal surface, an object that is opposed to the pad is pressed against a pad side while rotating the object, and a pad conditioner is provided that is in contact with the pad, comprising:
- detecting means provided on an object side and a pad conditioner side, for detecting a displacement of the pad in a z-direction;
- and
- swing units for adjusting inclination angles from a z-axis on the object side and the pad conditioner side based on detection signals that are output from the detecting means, respectively.
Dependencies are inferred from the claim text.