Method of forming a transparent window in a polishing pad
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Allan Gleason, William L. Guthrie
Life of this patent
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Abstract
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
Claims15
A method of forming a window in a polishing pad, comprising:
- forming an aperture in a polishing pad, the aperture including a first section with a first cross-sectional dimension adjacent a first surface of the pad and a second section with a second, different cross-sectional dimension adjacent a second surface of the pad opposite the first surface;
- and
- securing a transparent plug in the aperture.
A method of forming a window in a polishing pad, comprising:
- forming an aperture through a polishing pad, the aperture including a first section with a first cross-sectional dimension adjacent a polishing surface of the pad and a second section with a second, smaller cross-sectional dimension adjacent a back surface of the pad opposite the polishing surface;
- and
- securing a transparent plug in the aperture.
A method of chemical mechanical polishing, comprising:
- bringing a substrate into contact with a polishing surface of a polishing pad that has an aperture formed therein and a transparent plug secured in the aperture, the aperture including a first section with a first cross-sectional dimension adjacent the polishing surface of the pad and a second section with a second, different cross-sectional dimension adjacent a back surface of the pad opposite the polishing surface;
- causing relative motion between the substrate and the polishing surface;
- directing a light beam through the transparent plug;
- and
- monitoring reflections of the light beam from the substrate.
Dependencies are inferred from the claim text.