Apparatus and method for automated cassette handling

An automated semiconductor processing system comprising:

• a first semiconductor device fabrication tool comprising:
• at least a first process chamber;
• at least a first interface, the first interface comprising a chamber having:
• a first portion configured to allow a conveyor transporting a wafer carrier containing at least one wafer to pass therethrough;
• and
• a second portion configured to contain a wafer carrier containing at least one wafer without obstructing the operation of the conveyor, and without obstructing the passage of a wafer carrier containing at least one wafer being transported by the conveyor, the first and second portions being operatively coupled such that a wafer carrier containing at least one wafer may be elevated therebetween while remaining within the chamber;
• an elevator adapted to move wafer carriers between the first portion and the second portion;
• and wherein the second portion comprises:
• a first port connected to the first process chamber;
• and
• a second port adapted to connect to a second process chamber,
• the first port comprising a first wafer handler adapted to transfer at least one wafer between the elevator and the first process chamber, and the second port comprising a second wafer handler adapted to transfer at least one wafer between the elevator and the second process chamber;
• and
• a first conveyor which extends through the first portion of the first interface, wherein the first and second portions of the first interface are configured such that a first wafer carrier within the second portion of the first interface may index between a first position and a second position without obstructing the passage of a second wafer carrier traveling through the first portion of the first interface;
• a second semiconductor device fabrication tool comprising:
• at least a third process chamber;
• at least a second interface coupled to the third process chamber, the second interface comprising a chamber having:
• a first portion configured to allow a conveyor transporting a wafer carrier containing at least one wafer to pass therethrough;
• and
• a second portion configured to contain a wafer carrier containing at least one wafer without obstructing the operation of the conveyor, and without obstructing the passage of a wafer carrier containing at least one wafer being transported by the conveyor, the first and second portions being operatively coupled such that a wafer carrier containing at least one wafer may be elevated therebetween while remaining within the chamber;
• an elevator adapted to move wafer carriers between the first portion and the second portion;
• and wherein the second portion comprises:
• a first port connected to the third process chamber;
• and
• a second port adapted to connect to a fourth process chamber,
• the first port comprising a first wafer handler adapted to transfer at least one wafer between the elevator and the third process chamber, and the second port comprising a second wafer handler adapted to transfer at least one wafer between the elevator and the fourth process chamber;
• and
• a second conveyor which extends through the first portion of the second interface, wherein the first and second portions of the second interface are configured such that a first wafer carrier within the second portion of the second interface may index between a first position and a second position without obstructing the passage of a second wafer carrier traveling through the first portion of the second interface;
• and
• a third conveyor coupled to the second port of the first interface and to the second port of the second interface, wherein the first and second semiconductor device fabrication tools are coupled via the third conveyor and the first and second interfaces.

A method of transporting wafer carriers comprising:

• conveying a first wafer carrier containing a plurality of wafers via a conveyor to a first portion of an interface connecting a first process chamber and a second process chamber to the conveyor, the conveyor passing through the first portion;
• elevating the first wafer carrier to a second portion of the interface which is at a level adjacent the first and second process chambers;
• loading a first wafer to the first process chamber via a first port in the second portion of the interface;
• and
• loading a second wafer to the second process chamber via a second port in the second portion of the interface.

A method of conveying wafer carriers comprising:

• providing an interface comprising a chamber having a first and a second portion;
• conveying a wafer carrier via a first conveyor into the first portion of the interface, the interface connecting the first conveyor with a distant conveyor;
• and
• elevating the wafer carrier to the second portion of the interface which is at a level adjacent the distant conveyor.

An interface between a first process chamber and a second process chamber comprising:

• an elevator chamber comprising an elevator, a first portion configured to allow a conveyor transporting a wafer carrier containing at least one wafer to pass therethrough, and a second portion having:
• a first port adapted to connect to the first process chamber;
• and
• a second port adapted to connect to the second process chamber;
• the first port comprising a first wafer handler adapted to employ only single-axis movement during transfer of at least one wafer between the elevator chamber and the first process chamber, and the second port comprising a second wafer handler adapted to employ only single-axis movement during transfer of at least one wafer between the elevator chamber and the second process chamber.

An interface comprising:

• a first portion configured to allow a conveyor transporting a wafer carrier to pass therethrough;
• and
• a second portion having:
• a first port adapted to connect to a first process chamber, the first port comprising a first wafer handler adapted to transfer at least one wafer between the second portion and the first process chamber;
• a second port adapted to connect to a second process chamber, the second port comprising a second wafer handler adapted to transfer at least one wafer between the second portion and the second process chamber;
• a pod opening mechanism adapted to open a wafer carrier;
• an elevator adapted to elevate a wafer carrier between the first and second portions;
• and
• a conveyor which extends through the first portion, wherein the first and second portions are configured such that a first wafer carrier within the second portion may index between a first position and a second position without obstructing the passage of a second wafer carrier traveling through the first portion.

A method of transporting wafer carriers comprising:

• transferring a first wafer carrier containing a plurality of wafers via a transfer mechanism to a first portion of an interface connecting a first process chamber and a second process chamber to the transfer mechanism;
• elevating the first wafer carrier to a second portion of the interface at a level adjacent the first and second process chambers;
• opening a cover portion of the first wafer carrier while elevating the first wafer carrier;
• loading a first wafer to the first process chamber via a first port in the second portion of the interface;
• loading a second wafer to the second process chamber via a second port in the second portion of the interface;
• wherein the step of loading the first wafer and the step of loading the second wafer occur simultaneously;
• and
• transferring a second wafer carrier containing a plurality of wafers via the transfer mechanism through the first portion of the interface while the first wafer carrier is in the second portion of the interface.

A method of transporting wafer carriers comprising:

• conveying a first covered wafer carrier containing at least one wafer via a conveyor to a first portion of an interface through which the conveyor extends;
• lowering the first covered wafer carrier to a second portion of the interface;
• opening the first covered wafer carrier;
• sealing the first portion of the interface from the second portion of the interface via the cover portion of the first covered wafer carrier;
• and
• conveying a second covered wafer carrier through the first portion of the interface while the first wafer carrier is in the second portion of the interface.