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US 6,279,976 B1Granted
Wafer handling device having conforming perimeter seal
AssigneeMicron Technology, Inc.
InventorMichael B. Ball
Life of this patent
Estimating the term…
Abstract
A vacuum-assisted chuck assembly for coupling to a warped semiconductor wafer is provided. In one embodiment, the assembly comprises a wafer chuck and a conforming perimeter seal. The seal permits effective vacuum coupling of the chuck to the warped wafer without operator intervention. As vacuum pressure is applied, the seal prevents leakage around the warped wafer, allowing the vacuum pressure to deflect the wafer until the wafer contacts and seals against an engaging surface located on the chuck. By utilizing the seal, the chuck assembly may operate at a reduced vacuum pressure as compared to conventional wafer chucks. Furthermore, by providing an effective vacuum seal to the warped wafer surface, manual operator intervention during vacuum coupling is reduced or eliminated.
Claims47
A vacuum chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, the engaging surface being formed of a first material, wherein the planar engaging surface forms a ring;
- and
- at least one vacuum port in communication with the engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the flexible cup is formed of a second material which is more flexible than the first material.
4 more elements
A vacuum chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, the engaging surface being formed of a first material;
- and
- at least one vacuum port in communication with the engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the flexible cup is formed of a second material which is more flexible than the first material, and wherein the cup comprises a flared lip extending outwardly from the chuck in a funnel-like manner, the flared lip terminating at a lip edge.
4 more elements
A chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer;
- and
- at least one vacuum port in communication with the engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the cup comprises a flared lip extending outwardly from the chuck in a funnel-like manner, the flared lip terminating at a lip edge, and
- wherein the engaging surface extends beyond the lip edge.
5 more elements
A vacuum chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, the engaging surface being formed of a first material;
- and
- at least one vacuum port in communication with the engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup a adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the flexible cup is formed of a second material which is more flexible than the first material, and
- wherein the chuck is made of a plastic material.
5 more elements
A vacuum chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, wherein the planar engaging surface forms a ring;
- at least one vacuum port in communication with the planar surface;
- and
- a recessed portion in communication with the engaging surface wherein the vacuum port is located within the recessed portion, the recessed portion being defined along its outer boundary by the planar engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface;
- wherein the cup and the chuck are nonintegral.
5 more elements
A chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, wherein the planar engaging surface forms a ring;
- at least one vacuum part in communication with the planar surface;
- and
- a recessed portion in communication with the engaging surface wherein the vacuum port is located within the recessed portion, the recessed portion being defined along its outer boundary by the planar engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the cup comprises a flared lip extending outwardly from the chuck in a funnel-like manner, the flared lip terminating at a lip edge, and
- wherein the engaging surface extends beyond the lip edge.
6 more elements
A vacuum chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a chuck receiving component;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface,
- wherein the cup and the chuck are nonintegral.
5 more elements
A chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a chuck receiving component;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface,
- wherein the cup comprises a flared lip extending outwardly from the chuck in a funnel-like manner, the flared lip terminating at a lip edge, and
- wherein the engaging surface extends beyond the lip edge.
6 more elements
A chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a chuck receiving component;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an airtight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface, the cup having a flared lip extending outwardly from the chuck in a funnel-like manner and terminating at a lip edge,
- wherein the engaging surface extends beyond the lip edge.
5 more elements
A chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a chuck receiving component;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface, the cup having a flared lip extending outwardly from the chuck in a tunnel-like manner and terminating at a lip edge,
- wherein the cup further comprises a flange integrally adapted to mate with a groove on an outer surface of the chuck.
5 more elements
A vacuum chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer;
- one or more extension surfaces, the extension surfaces being substantially coplanar with the engagement surface;
- and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a chuck receiving component;
- a groove located on an outer surface of the chuck;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface and at least partially received in the groove, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup comprises a soft rubber material that maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface.
7 more elements
A vacuum chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer;
- one or more extension surfaces, the extension being substantially coplanar with the engagement surface;
- and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a chuck receiving component;
- a groove located on an outer surface of the chuck;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup comprises a soft rubber material that maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface, wherein the cup comprises a flared lip extending outwardly from the chuck in a funnel-like manner, the flared lip terminating at a lip edge, and
- wherein the engaging surface extends beyond the lip edge.
8 more elements
A vacuum chuck assembly for receiving and retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a cylindrical vacuum chuck having:
- a face side, the face side having a planar, ring-shaped engaging surface adapted to contact the wafer;
- one or more extension surfaces, the extension surfaces being substantially coplanar with the engagement surface;
- and a recessed portion bounded by the engaging surface;
- a backside adapted to couple the chuck to a receiving component;
- a groove located on an outer surface of the chuck;
- and
- at least one vacuum port located on the recessed portion, the vacuum port adapted to fluidly couple to a vacuum source;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup comprises:
- a soft rubber material that maintains the air-tight seal at least until the warped surface deflects, under application of vacuum pressure, sufficiently to conform the cup to the engaging surface;
- a cylindrical cup wall substantially surrounding a portion of the outer surface;
- a flared lip extending outwardly from a first end of the cup wall in a funnel-like manner, the flared lip terminating at a lip edge;
- and
- a flange integrally formed on a second end of the cup wall opposite the first end, the flange adapted to mate with the groove on the outer surface of the chuck.
12 more elements
A method of securing a semiconductor wafer having a warped surface to a vacuum chuck comprising:
- providing a chuck assembly, the chuck assembly having an engaging surface having at least one vacuum port thereon and a flexible cup extending around a perimeter of the engaging surface, the engaging surface adapted to receive a generally flat wafer surface;
- positioning the engaging surface proximal the wafer;
- activating a vacuum source fluidly coupled to the vacuum port to create vacuum pressure at the vacuum port;
- deflecting the cup by application of vacuum pressure wherein the cup conforms to the warped surface and seals thereto;
- and
- continuing to apply vacuum pressure wherein the vacuum pressure deforms the wafer and draws it to the engaging surface.
3 more elements
A vacuum chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, the engaging surface being formed of a first material;
- and
- at least one vacuum port in communication with the engaging surface;
- and a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the flexible cup is formed of a second material which is more flexible than the first material, and
- wherein the cup includes a lip cantilevered from the engaging surface, the lip tapering toward a free edge thereof.
4 more elements
A vacuum chuck assembly for receiving and fixedly retaining a semiconductor wafer having a warped surface, the chuck assembly comprising:
- a vacuum chuck having:
- a planar engaging surface adapted to seal against and retain the wafer, the engaging surface being formed of a first material;
- and
- at least one vacuum port in communication with the engaging surface;
- and
- a conforming flexible cup extending around a perimeter of the engaging surface, the cup adapted to form an air-tight seal between the engaging surface and the warped surface, wherein the cup maintains the air-tight seal until the warped surface deflects, under application of vacuum pressure, sufficiently to conform and seal against the engaging surface,
- wherein the flexible cup is formed of a second material which is more flexible than the first material, and
- wherein the first material is rigid plastic, and the second material is flexible rubber.
5 more elements
Dependencies are inferred from the claim text.