Soldering apparatus for providing a fixed quantity of solder piece onto target plate
AssigneeYamaha Corporation
InventorsAkifumi Inoue, Koshiro Takeda
Life of this patent
Estimating the term…
Abstract
A punching pin of a soldering apparatus cuts out a solder piece from a solder plate onto a feeder pin, and the feeder pin presses the solder piece against a predetermined junction of a conductive wiring pattern incorporated in a printed circuit board; then, an electric circuit component is mounted on the printed circuit board, and is strongly soldered to the conductive wiring pattern, because the punching pin and the feeder pin supply a fixed amount of solder to the predetermined junction.
Claims4
A soldering apparatus comprising a solder piece provider for supplying at least one solder piece on a target layer, said solder piece provider comprising:
- a die unit having at least one through-hole,
- a conveying mechanism selectively supplying a solder plate and a target layer in such a manner that said die unit is overlapped with one of said solder plate and said target plate,
- a punching mechanism provided on one side of said die plate and having a punching pin aligned with said through-hole for moving said punching pin into and out of said through-hole, thereby cutting out a solder piece from said solder plate so as to leave said solder piece in said through-hole, and
- a feeding mechanism provided on the other side of said die plate and having a feeder pin aligned with said through-hole for moving said feeder pin in said through-hole so as to press said solder piece against said target layer.
Dependencies are inferred from the claim text.