Piezoelectric sensor for measuring bonding parameters
AssigneesASM Assembly Automation Ltd., The Hong Kong Polytechnic University
InventorsLai Wa Chan-Wong, Siu San Chiu, Siu Wing Or, Yiu Ming Cheung
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Abstract
A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.
Claims19
A sensor for measuring bonding parameters in an ultrasonic bonding operation, said sensor comprising piezoelectric material located adjacent an ultrasonic transducer of an ultrasonic bonding apparatus, said sensor having a first output comprising a pair of electrodes oriented in a direction parallel to the direction of the applied impact force for sensing impact force, and a second output comprising a pair of electrodes oriented transversely to the direction of the applied impact force for sensing ultrasonic amplitude and bonding time.
Ultrasonic bonding apparatus comprising, an ultrasonic transducer and an ultrasonic concentrator located along an axis, said apparatus further including a sensor comprising piezoelectric material and being integrally formed as part of said apparatus, said sensor being located on said axis between said ultrasonic transducer and said ultrasonic concentrator adjacent said transducer, said sensor having a first output for sensing at least one first bonding parameter, and a second output for sensing at least one second bonding parameter.
Dependencies are inferred from the claim text.