Cooling apparatus using boiling and condensing refrigerant
AssigneeDenso Corporation
InventorHiroyuki Osakabe
Life of this patent
Estimating the term…
Loading patent…
AssigneeDenso Corporation
InventorHiroyuki Osakabe
Estimating the term…
A cooling apparatus includes a refrigerant tank having a surface to which heating devices are attached and containing liquid refrigerant which is boiled and evaporated by heat transferred from the heating devices. The refrigerant tank includes a refrigerant chamber, a condensed liquid passage, heat insulating passage, and a communication passage. The heat insulating passage is formed between the condensed liquid passage and the refrigerant chamber. A vapor reverse flow reducing plate having a small hole is provided at the bottom of a lower opening of the heat insulating passage to reduce vaporized refrigerant (bubble) flowing into the refrigerant chamber from the heat insulated passage. Accordingly, the movement of the bubbles from the heat insulating passage to the refrigerant chamber via the communication passage is suppressed, and the heat radiation performance is improved.
A cooling apparatus using boiling and condensing refrigerant for cooling an exothermic device, comprising:
Dependencies are inferred from the claim text.