Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Abstract
A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.
Claims22
A method for dicing a semiconductor substrate, comprising:
- substantially simultaneously severing the semiconductor substrate in at least first and
- second substantially linear, parallel locations;
- and severing the semiconductor substrate in at least a third substantially linear location
- parallel to said first and second substantially linear locations with at least one
- blade of a saw out of contact with the semiconductor substrate.
A method for dicing a semiconductor substrate, comprising:
- substantially concurrently forming cuts at least partially through the semiconductor substrate in at least first and second parallel, substantially linear locations thereof;
- and
- forming at least another cut at least partially through the semiconductor substrate at at least a third substantially linear location thereof with at least one blade of a saw used to effect said forming out of contact with the semiconductor substrate, said at
- least said third substantially linear location being parallel to said first and second substantially linear locations.
Dependencies are inferred from the claim text.