Method of forming a resilient contact structure
OwnerIgor Y. Khandros, Gaetan L. Mathieuinventors
Life of this patent
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Abstract
An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
Claims22
A method of forming a resilient contact structure comprising:
- mounting a portion of an elongate flexible core element to a terminal of an electronic component, the elongate flexible core element having a length extending from the electronic component, the length having first and second sections, and a change in direction of the length between the first and second sections;
- and
- then forming a conductive shell over at least the first and second sections of the length of the elongate flexible core element, wherein;
- (i) the conductive shell comprises at least one layer having a material which has a yield strength of at least thirty thousand pounds per square inch;
- and
- (ii) the elongate flexible core element and the conductive shell being formed to be a free standing interconnection spring element having a portion secured to the terminal, a contact region located distant from the electronic component, and an elongate section between the portion and the contact region, the elongate section having a shape which allows the elongate section to bend when the contact region is depressed towards the terminal, the elongate section substantially returning to an original shape due to resiliency thereof because of the yield strength of the material of the conductive shell.
A method of forming a resilient contact structure comprising:
- mounting a portion of elongate flexible core element to a terminal of an electronic component, the elongate flexible core element having a length extending from the electronic component, the length having first and second sections and a change in direction of the length between the first and second section;
- and
- then forming a conductive shell over at least the first and second sections of the length of the elongate flexible core element, wherein;
- (i) the conductive shell comprises at least one layer having a material and
- (ii) the elongate flexible core element and the conductive shell being formed to be a free standing interconnection spring element having a portion secured to the terminal, a contact region located in an original position distant from the electronic component, and an elongate section between the portion and the contact region, the elongate section having a shape which allows the elongate section to bend when the contact region is depressed by an actuation force towards the terminal, the elongate section substantially returning to an original shape when the actuation force is removed from the contact region, so that the contact portion returns to the original position.
Dependencies are inferred from the claim text.