US 6,279,226 B1Granted

Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip

AssigneesHitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd.

InventorsTatsuyuki Ohkubo, Keisuke Nadamoto, Yoshifumi Katayama

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Abstract

A method and apparatus for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGAoIC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and each electrode pad of the chip is bonded to each inner lead is disclosed. The inner lead is bonded to the electrode pad when the chip is supplied in a fixed position for a bonding tool using a sprocket hole of the tape carrier. Next, the respective positions of the inner lead and the electrode pad are recognized using a feature lead and an electrode pad. Afterward, the center line of the inner lead is recognized, the inner lead is touched to the chip by the bonding tool and after the inner lead is pushed in the direction of the base and bent in the form of a letter S, the end of the inner lead is bonded to the electrode pad by thermocompression by the bonding tool.

Claims3

Dependent claims

A single lead bonding machine for bonding inner leads of a chip lead complex to bonding pads on a lead by-lead basis, wherein said chip lead complex includes (i) a semiconductor integrated circuit chip having a plurality of bonding pads, and (ii) a plurality of inner leads disposed over a carrier tape and extending over respective bonding pads in an opening of the carrier tape over the bonding pads, said integrated circuit chip being secured to the carrier tape, said lead bonding machine comprising:

(a) a loading reel for advancing a carrier tape wound thereon;
(b) a tape transfer system for feeding the chip lead complex over the advancing carrier tape to a bonding stage, the chip lead complex having both said semiconductor integrated circuit chip and said inner leads fixed over the carrier tape;
(c) an optical observing system for observing the position of the inner leads and the bonding pads to which bonding is to be performed;
(d) a bonding tool, at the bonding stage, which corrects misalignment of a position of the inner leads with respect to the bonding pads by deforming one of said inner leads toward a corresponding one of said bonding pads by moving the bond tool in a direction parallel to a surface of the semiconductor integrated circuit chip in accordance with the observation by the observing system, and for bonding the inner leads to the respective bonding pads on the lead-by-lead basis;
(e) an unloading reel for taking in the carrier tape after the bonding.

2 more elements

Dependencies are inferred from the claim text.