Apparatus for handling packaged IC's

Apparatus for automatic handling of packaged integrated circuits (IC), comprising:

• at least one automatic motion control means;
• chip precisor means (860, 865, 870) for receiving an IC package;
• socket precisor means (820, 825, 830, 835) for receiving a socket in a predetermined alignment relative to the chip precisor means;
• and
• releasable chip retainer means (482/282, 470) for retaining the IC package within the chip precisor means, the releasable chip retainer means including a gripper assembly configured to engage the IC package;
• wherein the chip precisor means and the socket precisor means comprise features of a handler head (420) that is coupled to said at least one automatic motion control means by flexible mounting means (455), such that the socket precisor means is aligned with the socket to receive the socket as the handler head is displaced toward the socket by the automatic motion control means, the socket precisor means seating itself on the socket as the handler head is displaced toward the socket, the flexible mounting means allowing deflection of a lower end of the handler head when lateral force is applied to the precisor block.

An apparatus for automatically transferring packaged integrated circuits (ICs) between a tray and a low-insertion force (LIF) socket, comprising a handler head coupled by (a resilient mount to an automatic motion control system, said motion control system being configured to automatically displace the handler head toward and away from the LIF socket and the tray, the handler head comprised of:

• a nozzle body having a suction nozzle configured to apply suction sufficient to remove and retain a packaged IC from the tray;
• a precisor block connected to the nozzle body, which precisor block is adapted to fit over an outer wall of the LIF socket so as to align the handler head relative to the LIF socket, the precisor block including a bottom portion with an opening and an interior surface that defines a chip precisor feature;
• a gripper assembly having gripper fingers to engage the packaged IC when the packaged IC is located in the LIF socket, upward movement of the handler head providing sufficient force to extract the packaged IC from the LIF socket;
• and
• wherein the suction nozzle is resiliently biased downwardly to extend through said opening below the bottom portion of the precisor block, suction applied to the nozzle causing the nozzle to retract upward when in contact with a surface of the IC package)so as to retain the IC package within the precisor block, the chip precisor feature positioning the IC package relative to the precisor block.