Radiation detection device and method of making the same

A method of making a radiation detection device comprising:

• forming a light-receiving portion, said forming a light-receiving portion including
• one- or two-dimensionally arranging a plurality of light-receiving devices and a plurality of bonding pads electrically connected to said light-receiving devices in respective rows or columns of said light-receiving portion and disposed outside said light-receiving portion on a substrate, and
• depositing a scintillator layer for converting a radiation into detectable light with said light receiving devices thereon;
• forming a radiation-transmittable, moisture-resistant protective film so as to envelope said light-receiving device array as a whole;
• cutting and removing at least part of said moisture-resistant protective film, outside said scintillator layer, covering said bonding pads so as to expose at least the part of said light-receiving device array in an area including said bonding pads;
• and
• coating a peripheral portion of said moisture-resistant protective film with a resin so as to bond the edge of said moisture-resistant protective film to said light-receiving device array.

A method of mailing a radiation detection device comprising:

• forming a light-receiving portion by one- or two-dimensionally arranging a plurality of light-receiving devices and a plurality of bonding pads electrically connected to said light-receiving devices in respective rows or columns of said light-receiving portion are disposed outside said light-receiving portion on a substrate, and depositing a scintillator layer for converting a radiation into detectable light with said light-receiving devices thereon;
• forming a radiation-transmittable, moisture-resistant protective film configured to envelope said light-receiving device array as a whole;
• cutting said moisture-resistant protective film along an outer periphery of said scintillator layer at a position between the outer periphery of said scintillator layer and said bonding pad portion, and removing the part of said moisture-resistant protective film formed outside thus cut surface and on the side opposite to an entrance surface so as to expose said bonding pads;
• and
• coating an outer peripheral portion of said moisture-resistant protective film with a resin so as to bond the outer peripheral portion of said moisture-resistant protective film to said light-receiving device array.