Hermetically sealed semiconductor laser device
AssigneeBandwidth 9, Inc.
InventorsConstance Chang-Hasnain, Renato Dato, Philip Worland, Rang-Chen Yu
Life of this patent
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Abstract
A wafer assembly that includes a wafer substrate. A plurality of micro-optomechanical or micro-optoelectrical devices are positioned on a surface of the wafer substrate. Each micro-optomechanical or micro-optoelectrical device has a seal surface. A plurality of seal caps are coupled to the micro-optomechanical or micro-optoelectrical devices. Each seal cap has a seal ring. The seal cap seal ring is coupled to a seal surface of the micro-optomechanical or micro-optoelectrical device to form a hermetic seal.
Claims55
A tunable semiconductor laser assembly, comprising:
- a laser including a seal surface, a semiconductor active region positioned between upper and lower confining regions of opposite type semiconductor material, first and second reflective members positioned at opposing edges of the active and confining regions;
- and
- a seal cap including a seal ring, wherein the seal cap seal ring is coupled to the seal surface to form a hermetic seal.
A tunable semiconductor laser assembly, comprising:
- a heatsink;
- a laser coupled to the heatsink, the laser including a semiconductor active region positioned between upper and lower confining regions of opposite type semiconductor material, first and second reflective members positioned at opposing edges of the active and confining regions;
- and
- a seal cap including a seal ring, wherein the seal cap seal ring is coupled to the seal surface to form a hermetic seal.
A tunable semiconductor laser assembly, comprising:
- a laser including,
- an electrically responsive substrate including a substrate seal ring;
- a support block positioned on the electrically responsive substrate;
- a top reflecting member and a bottom reflecting member;
- a cantilever structure including a base section resting on the support block, a deformable section extending above the electrically responsive substrate and creating an air gap between the deformable section and the electrically responsive substrate, and an active head positioned at a predetermined location on the deformable section and including at least a portion of the top reflecting member;
- and
- a seal cap including a seal ring, wherein the seal cap seal ring is coupled to the substrate seal ring and form a hermetic seal.
A wafer assembly, comprising:
- a wafer substrate;
- a plurality of optoelectrical devices positioned on a surface of the wafer substrate, each of an optoelectrical device including a seal surface;
- and
- a plurality of seal caps, each of a seal cap including a seal ring, wherein the seal cap seal ring is coupled to a seal surface of an optoelectrical device and form a hermetic seal.
A wafer assembly, comprising:
- a wafer substrate;
- a plurality of micro-optomechanical devices positioned on a surface of the wafer substrate, each of a micro-optoelectrical device including a seal surface;
- and
- a plurality of seal caps, each of a seal cap including a seal ring, wherein the seal cap seal ring is coupled to a seal surface of a micro-optomechanical device and form a hermetic seal.
An array of tunable semiconductor laser assemblies, comprising:
- an array of lasers, each of a laser including a seal surface, a semiconductor active region positioned between upper and lower confining regions of opposite type semiconductor materials, first and second reflective members positioned at opposing edges of the active and confining regions;
- and
- an array of seal caps, each of a seal cap including a seal ring, wherein each seal cap seal ring is coupled to the seal surface of the laser to form a hermetic seal.
Dependencies are inferred from the claim text.