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AssigneeInternational Business Machines Corporation
InventorsDavid L. Edwards, Glenn G. Daves, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo
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The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.
A thermal paste preform for assembly in a semiconductor package having a heat generating device and a heat dissipation device with a gap therebetween, the thermal paste preform comprising a slug of thermal paste material, said slug having a shape so as to substantially cover said heat generating device upon assembly in the semiconductor package, said slug having a slug thickness not less than the gap between the heat generating device and the heat dissipation device, said slug having a temperature and having stiffness and tackiness properties in accordance with the temperature thereof, so that the stiffness and tackiness properties of the slug facilitate shipping and storing of said thermal paste preform.
A semiconductor package comprising:
Dependencies are inferred from the claim text.