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US 6,275,246 B1Granted
Thermal printhead
AssigneeRohm Co., Ltd.
InventorsTsutomu Hasegawa, Hiroaki Hayashi
Life of this patent
Estimating the term…
Abstract
A thermal printhead according to the present invention includes a substrate, a plurality of heating elements formed on the substrate, at least one drive IC for driving the heating elements, and a sealing portion for sealing the drive IC. The sealing portion contains a resin material and a granular filler having an average grain size not greater than 10 μm.
Claims16
A thermal printhead comprising:
- a substrate,
- a plurality of heating elements formed on the substrate,
- at least one drive IC for driving the heating elements, and
- a sealing portion for sealing the drive IC;
- wherein the sealing portion contains a resin material and a granular filler having an average grain size not greater than 10 μm.
2 more elements
A method of sealing a drive IC with resin, comprising:
- a mixing step for preparing a composite resin material by mixing a granular filler having an average grain size of not greater than 10 μm with a resin material;
- an applying step for applying the composite resin material onto a substrate of a thermal printhead so as to cover a drive IC mounted on the substrate;
- and
- a hardening step for hardening the composite resin material by heating.
1 more element
Dependencies are inferred from the claim text.