Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component

A device (1) which is provided with a data carrier (4) which is arranged for contactless communication with a communication station,

• includes a casing (5) which consists of an electrically insulating material and is formed by injection molding,
• includes holding means (6) which are surrounded by the casing (5) and are arranged to hold a chip (7) and at least one passive component (8, 13;
• 44) which is suitable for contactless communication, and
• is also provided with electrically conductive connection means (16) which are surrounded by the casing (5), thus being fully enclosed by the casing (5), are connected to the holding means (6) and by means of which a respective chip terminal (9, 10) of the chip (7) is electrically conductively connected to a respective component terminal (11, 12, 14, 15) of the at least one component (8, 13;
• 44),
• characterized in that
• the holding means (6) include a holding foil (17) of an electrically non-conductive synthetic material,
• that the connection means (16) are realized while utilizing a conductor frame (18) consisting of metal,
• that the connection means (16) are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;
• 42, 43, 45, 46) of said conductor frame (18) which are completely enclosed by the casing (5), and
• that at least parts of the conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;
• 42, 43, 45, 46) of said conductor frame (18) are connected to the holding foil (17) in order to hold said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31;
• 42, 43, 45, 46).