Probe card and testing method for semiconductor wafers

In a test apparatus for testing a semiconductor wafer having a contact location thereon, the test apparatus configured to support the wafer and including a probe card fixture, a probe card for establishing temporary electrical communication with the wafer comprising:

• a substrate comprising a contact member configured to electrically contact the contact location, the contact member comprising a raised member on the substrate at least partially covered with a conductive layer and a first conductor on the substrate in electrical communication with the conductive layer;
• and
• a membrane physically and electrically attaching the substrate to the probe card fixture, the membrane comprising a flexible electrically insulating polymer tape, and a second conductor on the polymer tape bonded to the first conductor, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact member thereon to move freely in a z-direction during electrical contact with the contact location.

In a test apparatus for testing semiconductor dice contained on a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising:

• a substrate comprising a plurality of raised contact members at least partially covered with conductive layers, and a plurality of conductors in electrical communication with the contact members, each contact member comprising a surface and at least one projection on the surface sized and shaped to penetrate a contact location on the wafer while the surface limits further penetration;
• and
• a membrane configured to physically and electrically attach the substrate to the test apparatus, the membrane comprising a flexible polymer tape having an opening for the substrate and a plurality of second conductors on the tape bonded to the conductors on the substrate, the membrane having a flexibility and a slack sufficient to allow the substrate and the contact members thereon to move freely in a z-direction during electrical contact with the contact locations.

In a test apparatus including a test circuitry for testing a semiconductor wafer having a circuit side and a contact location on the circuit side, a probe card for establishing temporary electrical communication with the wafer comprising:

• a substrate comprising a raised contact member configured to electrically contact a contact location on the wafer, the contact member comprising a projection configured to penetrate the contact location, and a surface configured to limit a penetration depth of the projection into the contact location;
• and
• a flexible membrane configured to electrically connect the contact member to the test circuitry and to physically mount the substrate to the test apparatus proximate to the wafer which is supported circuit side up by the test apparatus, the membrane comprising a polymer tape and a conductor on the polymer tape in electrical communication with the contact member and with the test circuitry, the membrane having a flexibility and a slack on the test apparatus such that the substrate and the contact member can move for making electrical contact with the contact location.

In a test apparatus comprising a probe card fixture and a test circuitry for applying test signals to a semiconductor wafer, a probe card for establishing temporary electrical communication with the wafer comprising:

• a substrate comprising a contact member for electrically contacting a contact location on the wafer and a bonding pad in electrical communication with the contact member;
• and
• a membrane configured to physically support the substrate proximate to the wafer as it is supported by the test apparatus and to electrically connect the substrate to the test circuitry, the membrane comprising a flexible polymer tape having an opening for the substrate and a conductor on the tape in electrical communication with the test circuitry bonded to the bonding pad, the membrane having a flexibility sufficient to allow movement of the substrate and the contact member in a z-direction during electrical contacting of the contact location.