Copper wire-bonding pad
AssigneeInternational Business Machines Corporation
InventorCyprian E. Uzoh
Life of this patent
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Abstract
A copper-containing, wire-bonding pad structure for bonding to gold wires. The structure includes a nickel-containing film to improve metallurgical characteristics. The structure also has a laminated impurity film within the copper pad, which complexes with the nickel-containing pad to prevent a destructive interaction between nickel and copper at elevated temperatures, or during the lifetime of the device or the wirebond.
Claims8
An improved copper-containing pad for gold wire bonding having an upper copper surface and a nickel-containing film disposed over said upper copper surface including nickel and a component, wherein the improvement comprises:
- an impurity disposed beneath said upper copper surface;
- an interface formed between said nickel-containing film and said upper copper surface;
- and
- a chemical mixture disposed at said interface and formed from an interaction between said nickel-containing film and an impurity film originally laminated within said pad.
Dependencies are inferred from the claim text.