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US 6,274,934 B1Granted
Semiconductor device and method of manufacturing thereof
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHiroshi Shirota
Life of this patent
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Abstract
A semiconductor device and a method of manufacturing thereof are provided so as to make a spare electronic circuit available without changing arrangement of normal electronic circuit interconnections under a design rule. In order to achieve this, second metal interconnections as spare electronic circuit interconnections are preliminary formed in a region where the spare inverter circuit is formed.
Claims8
A semiconductor device comprising:
- a plurality of normal electronic circuits formed at a main surface of a semiconductor substrate;
- a spare electronic circuit formed at said main surface of said semiconductor substrate;
- and
- a normal electronic circuit interconnection for electrically connecting said normal electronic circuits with each other, said normal electronic circuit interconnection including normal conductive layers formed above said main surface of said semiconductor substrate to respectively extend substantially in parallel with a plurality of layers which are substantially in parallel with said main surface and having a substantially minimum limit width under an applied design rule,
- space between said normal conductive layers being defined so as not to allow another conductive layer to newly be formed under said design rule in almost all regions except for a predetermined region, and
- a spare path for an electronic circuit interconnection being provided so as to form an electronic circuit interconnection which connects said spare electronic circuit with said normal electronic circuit interconnection without making a change in interconnection which is accompanied by change in arrangement of said normal electronic circuit interconnection under said design rule if change in interconnection becomes necessary in said predetermined region in order to use said spare electronic circuit.
3 more elements
A method of manufacturing a semiconductor device comprising the steps of:
- forming a plurality of normal electronic circuits and at least one spare electronic circuit at a main surface of a semiconductor substrate;
- forming an insulating film on said semiconductor substrate to cover said normal electronic circuits and said spare electronic circuit;
- preparing a normal mask having a normal pattern formed so as to form a normal electronic circuit interconnection electrically connecting said normal electronic circuits with each other and preparing a spare mask having in addition to a pattern substantially similar to said normal pattern a pattern of a spare electronic circuit interconnection for using said spare electronic circuit;
- inspecting said normal electronic circuits;
- and
- selecting, based on result of said inspection, any of said normal mask or said spare mask so as to form on said insulating film an electronic circuit interconnection connecting said normal electronic circuits with each other or connecting said normal electronic circuits with said spare electronic circuit,
- said normal pattern defined to ensure a spare path for an electronic circuit interconnection which enables said spare electronic circuit interconnection to be formed without making a change which is accompanied by change in arrangement of the pattern of said normal electronic circuit interconnection under an applied design rule.
4 more elements
Dependencies are inferred from the claim text.