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AssigneeSamsung Electronics Co., Ltd.
InventorsJun-Young Jeon, Jong-Hyun Choi
Estimating the term…
Integrated circuit packages include an integrated circuit substrate having microelectronic devices therein and pads, wherein first ones of the pads are enabled to provide output data from the microelectronic devices, and wherein second ones of the pads are disabled to provide a reduced path width for the integrated circuit substrate. A packaging substrate includes terminals, a respective one of which is connected to a respective one of the pads, including the second ones of pads that are disabled to provide a reduced path width for the integrated circuit substrate. Accordingly, the same packaging substrates may be used with integrated circuit substrates having different path widths. In a preferred embodiment, the integrated circuit substrate includes a control circuit that disables the second ones of the pads to provide a reduced path width for the integrated circuit substrate. The control circuit preferably includes at least one fuse that disables the second ones of pads to provide the reduced path width for the integrated circuit substrate.
An integrated circuit package comprising:
A method of packaging a plurality of integrated circuit substrates including a plurality of microelectronic devices therein and a plurality of first and second pads, the integrated circuit substrates comprising first integrated circuit substrates wherein the first pads are enabled to provide output data from the microelectronic devices and wherein the second pads are disabled to provide a reduced path width for the first integrated circuit devices, the integrated circuit substrates further comprising second integrated circuit substrates wherein the first and second pads are enabled to provide output data from the microelectronic devices, the method comprising the step of:
An integrated circuit comprising:
Dependencies are inferred from the claim text.