Multi-chip module with stacked dice
AssigneeMicron Technology, Inc.
InventorsVenkateshwaran Vaiyapuri, Jicheng Yang
Life of this patent
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Abstract
A multi-chip module may be formed by wire bonding a first chip within a cavity in a multi-chip carrier. A second die may be positioned over the first die, elevated therefrom, using bump bonding. In some embodiments, only a single cavity is utilized and in other embodiments, multiple cavities may be utilized, one of which mounts a first chip and the other of which mounts a second chip. In some embodiments, the second chip may be a composite of two dice coupled back-to-back so that the lowermost die may be bump bonded to the carrier and the uppermost die, facing upwardly away from the carrier, may be wire bonded thereto.
Claims20
A multi-chip module comprising:
- a structure having a cavity for receiving a die;
- a first die having a top side and a backside, said backside mounted in said cavity and said top side wirebonded to said structure;
- a second die mounted in said structure over said first die, said second die being bump bonded to said structure;
- and
- solder balls secured on said structure, said solder balls electrically coupled to said first and second dice.
The module of 9 including a first cavity mounting said first die and a second cavity, said first die being wire bonded to said second cavity, said structure including an upper surface and a third cavity, said second die bump bonded to a third cavity and wire bonded to the upper surface of said structure.
A multi-chip module comprising:
- a carrier having a first side and a second side and a cavity formed in said first side;
- first and second chips mounted on said first side of said carrier with said second chip over said first chip, said first chip secured to said carrier in said cavity;
- said first and second chips being electrically coupled to said first side, said second chip being bump bonded to said first side and said first chip being wire bonded to said first side.
A multi-chip module comprising:
- a carrier including a cavity;
- a first chip secured to said carrier in said cavity;
- and
- a second chip including a pair of dice secured to one another in back to back relationship, said second chip secured to said carrier over said first chip.
Dependencies are inferred from the claim text.