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US 6,274,929 B1Granted
Stacked double sided integrated circuit package
AssigneeTexas Instruments Incorporated
InventorsChew Weng Leong, Chee Kiang Yew, Min Yu Chan, Pang Hup Ong, Jeffrey Tuck Fook Toh, Boon Pew Chan
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Abstract
A high density unit (130, 160) comprising a first integrated circuit package (30, 32) comprising a carrier (70) having first and second sides (92, 94), a silicon chip (50) attached by an adhesive layer (60) and solder bonding (80) electrically connecting the silicon chip (50) to the carrier (70) stackably and electrically connected to a second integrated circuit package (30, 32), is disclosed.
Claims12
An integrated circuit package which comprises:
- a first carrier having a first pair of opposing surfaces, each surface having a pair of opposing end portions with terminals on both of said opposing surfaces and at both of said opposing end portions;
- a first interconnect disposed in said first carrier extending to at least one of said terminals on each of said first pair of opposing surfaces;
- a first semiconductor chip having a bonding pad, said first semiconductor chip attached to said first carrier by an adhesive layer;
- a first interconnection electrically connecting said first semiconductor chip bonding pad to said first interconnect by a routing strip in said first carrier, wherein said routing strip is directly connected to said first connection;
- and
- a solder ball connected to said terminals on both of said surfaces.
3 more elements
Dependencies are inferred from the claim text.