Surface mountable LED package
AssigneeLumileds Lighting U.S., LLC
InventorsJulian A. Carey, William D. Collins, III, Ban Poh Loh, Gary D. Sasser
Life of this patent
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Abstract
An LED package includes a heat-sinking slug that is inserted into an insert-molded leadframe. The slug may include an optional reflector cup. Within this cup, the LED and a thermally conducting sub-mount may be attached. Wire bonds extend from the LEDs to metal leads. The metal leads are electrically and thermally isolated from the slug. An optical lens may be added by mounting a pre-molded thermoplastic lens and a soft encapsulant or by casting epoxy to cover the LED or by a cast epoxy lens over a soft encapsulant.
Claims28
A light emitting die assembly comprising:
- metal leads;
- an insulating body attached to the metal leads, the insulating bode having a cavity;
- a heat sink of a first thermally conductive material, the heat sink separate from the metal leads, connected to the insulating body and positioned relative to the cavity for being thermally coupled to a die;
- and
- a lens, positioned relative to the cavity for transmitting light emitted from the die.
A light emitting die assembly comprising:
- metal leads;
- an insulating body attached to the metal leads, the insulating body having a cavity;
- and
- a heat sink of a first thermally conductive material, the heat sink separate from the metal leads, connected to the insulating body, and positioned relative to the cavity for being thermally coupled to a die.
Dependencies are inferred from the claim text.