Inspection apparatus and method using particle beam and the particle-beam-applied apparatus
AssigneeHitachi, Ltd.
InventorsYoshimi Kawanami, Akio Yoneyama, Tadashi Otaka
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsYoshimi Kawanami, Akio Yoneyama, Tadashi Otaka
Estimating the term…
The inspection apparatus uses a particle beam and has a high throughput by obtaining a characteristic frequency corresponding to the characteristic quantity of focusing-shift from a Fourier spectrum of a sample image using a focusing-shift evaluator. A beam blur profile is produced corresponding to the characteristic frequency in a beam blur profile generator. A component of the beam-blur profile is removed from the sample image stored in one dimensional image memory using a de-convolution operator. A dimensional measurement is performed in a critical dimension evaluator for an obtained sample image. Since time spent for focus adjustment using particle beam scanning is obviated, it is possible to reduce the inspection time for a dimension and an appearance abnormality of a semiconductor element.
A method of measuring a fine dimension of an object sample comprising the steps of:
An inspection apparatus employing a particle-beam having a sample-image-obtaining means for scanning said particle-beam on an object sample, the apparatus comprising:
An inspection method using a particle beam comprising the steps of:
Dependencies are inferred from the claim text.