US 6,274,823 B1Granted

Interconnection substrates with resilient contact structures on both sides

AssigneeFormFactor, Inc.

InventorsIgor Y. Khandros, Gaetan L. Mathieu

Life of this patent

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Abstract

An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond. The component carries the contact structures on both sides, the spacing of the structures on the first side being different than that of the second side.

Claims15

Dependent claims

A space transformer comprising:

a first substrate provided with first electrical contact areas on one side thereof;
first resilient contact structures, each having an elongate springable shape and a respective portion connected to a respective first electrical contact area of said first electrical contact areas, and extending from the respective first electrical contact area;
a second substrate provided with second electrical contacts on one side thereof and third electrical contacts on an opposite side thereof, the second contact areas facing the first contact areas and each first resilient contact structure having a respective contact region connected to a respective one of the second electrical contacts, the second substrate being demountable from the first substrate;
and
second resilient contact structures, each having an elongate springable shape and a respective portion connected to a respective third electrical contact area of said third electrical contact areas and extending from the respective third electrical contact area,
selected ones of the first resilient contact structures are interconnected with selected ones of the second contact structures, and
selected ones of the first contact areas are spaced from one another by first distances, and selected ones of the second resilient contact structures have contact regions, remotely located from the portions thereof, which are spaced from one another by second distances which are different from the first distances.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/735,812Filed 21 Oct 1996 · continuation
Priority: 16 Nov 1993
Granted: 14 Aug 2001
Term ends: Not estimatedThe source records don’t support an estimate.

Classification83 codes

H05K 7/1069
Co-operating by abutting: with spring contact pieces
G01R 1/0466
Details: concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
G01R 1/0483
Sockets for IC's or transistors: sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged,…
G01R 1/06711
Measuring probes: probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins

Family

Application08/152,812Parent of this continuation-in-part · filed 16 Nov 1993
Application08/340,144Parent of this continuation · filed 15 Nov 1994
US 5,917,707 AParent of this continuation
Application08/340,144Parent of this continuation-in-part
US 5,476,211 AParent of this continuation-in-part
US 6,274,823 B1This patent

From the US filing history. Foreign family members aren’t listed.