Manufacture of semiconductor connection components with frangible lead sections
AssigneeTessera, Inc.
InventorsDavid Light, Belgacem Haba, Thomas H. Distefano, Konstantine Karavakis
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Abstract
A semiconductor chip connection component having numerous leads extending side-by-side across a gap in a support structure, each lead having a frangible section to permit detachment of one end of the lead from the support structure in a bonding process. The frangible sections are formed by treating the lead-forming material in an elongated treatment zone extending across the regions occupied by numerous leads to provide a step defining a fracture point of the lead during a wire bonding process.
Claims7
A method of making a semiconductor connection component comprising the steps of forming at least one lead extending over a gap extending through a vertical extent of a support structure, each said lead having upper and lower surfaces and including a first connection section having a longitudinal axis extending from the support structure on one side of the gap, a second connection section extending from the support structure on the other side of the gap, and a frangible intermediate section contiguously connecting said connection sections, said frangible intermediate section and at least a part of said first connection section aligned over said gap so that said first connection section of each lead can be detached from said second connection section by breaking the frangible section upon being displaced downwardly in said gap, and forming at least one vertical jog within said frangible intermediate section such that the upper and lower surfaces of the lead are offset from one another at each said vertical jog.
Dependencies are inferred from the claim text.