US 6,274,803 B1Granted

Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same

AssigneeMatsushita Electric Works, Ltd.

InventorsHirokazu Yoshioka, Kazuo Kamada, Yoji Urano, Kentaro Kobayashi

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Abstract

A thermoelectric chip with exposed surfaces of N-type and P-type semiconductor elements on its top and bottom surfaces is prepared by arranging the semiconductor elements in a matrix manner such that each of the N-type semiconductor elements is disposed adjacent to the P-type semiconductor element through a space, and filling the space with a first resin material having electrical insulation. A metal layer is formed on each of the exposed surfaces of the semiconductor elements. Then, first electrodes are formed on the top surface according to a first circuit pattern. Similarly, second electrodes are formed on the bottom surface according to a second circuit pattern different from the first circuit pattern. An electrical insulation sheet of a second resin material containing a ceramic powder with high thermal conductivity is bonded to the top and bottom surfaces to obtain the thermoelectric module.

Claims10

Dependent claims

A thermoelectric module with improved heat-transfer efficiency comprising:

a thermoelectric chip with exposed surfaces of first-type and second-type thermoelectric elements on its top and bottom surfaces, in which said thermoelectric elements are arranged in a matrix manner such that each of said first-type thermoelectric elements is disposed adjacent to said second-type thermoelectric element through a space, and said space is filled with a first resin material having electrical insulation;
a metal layer formed on each of the exposed surfaces of said thermoelectric elements on the top and bottom surfaces of said thermoelectric chip;
first electrodes formed on the top surface of said thermoelectric chip according to a first circuit pattern, each of which electrically connects between adjacent thermoelectric elements;
and
second electrodes formed on the bottom surface of said thermoelectric chip according to a second circuit pattern different from the first circuit pattern, each of which electrically connects between adjacent thermoelectric elements;
wherein said thermoelectric module is provided with one of the following two components (A) and (B):
(A) an electrical insulation layer made of a second resin material containing a ceramic powder with high thermal conductivity, which is formed on at least one of the entire top surface with the first electrodes and the entire bottom surface with the second electrodes of said thermoelectric chip;
and
(B) an electrical insulation layer made of a third resin material, which is formed on at least one of the entire top surface with the first electrodes and the entire bottom surface with the second electrodes of said thermoelectric chip, and a heat-transfer layer composed of a metal sheet with a ceramic-sprayed coating having high thermal conductivity, which is formed on said insulation layer such that the ceramic sprayed coating contacts said insulation layer.

6 more elements

Dependencies are inferred from the claim text.