Method for producing a group III nitride compound semiconductor substrate
AssigneeMatsushita Electronics Corporation
InventorsMasaaki Yuri, Osamu Imafuji, Shinji Nakamura, Masahiro Ishida, Kenji Orita
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AssigneeMatsushita Electronics Corporation
InventorsMasaaki Yuri, Osamu Imafuji, Shinji Nakamura, Masahiro Ishida, Kenji Orita
Estimating the term…
The present invention provides a method for producing a group III nitride compound semiconductor substrate including: (a) forming a first semiconductor film over a substrate, the first semiconductor film made of a first group III nitride compound semiconductor and provided with a step; (b) forming a second semiconductor film made of a second group III nitride compound semiconductor having a different thermal expansion coefficient from that of the first group III nitride compound semiconductor on the first semiconductor film; and (c) cooling the substrate and separating the second semiconductor film from the first semiconductor film. Thus, a large-area group III nitride compound semiconductor substrate can be produced in high yields and with high reproducibility.
A method for producing a group III nitride compound semiconductor substrate, comprising:
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