Multilayered wiring structure and method of manufacturing the same

A method of manufacturing a multilayered wiring structure, comprising:

• forming an insulating layer on a metal substrate;
• forming a wiring layer on said insulating layer;
• forming an opening in said wiring layer to expose said insulating layer;
• forming a hole in said insulating layer exposed by said opening, to expose an upper portion of said metal substrate;
• forming a filling layer made of a conductive material to fill said hole;
• and
• forming a metal layer on said wiring layer to contact said filling layer.

A method of manufacturing a multilayered wiring structure, comprising:

• forming a first insulating layer on a substrate;
• forming a first wiring layer on said first insulating layer;
• forming a conductor film made of a metal on an insulating film;
• forming a hole in said insulating film to expose said conductor film;
• forming a filling layer made of a first metal and a second metal covering said first metal to fill said hole;
• adhering said insulating film with said conductor film formed thereon to said first wiring layer, said conductor film being located over the insulating film, such that said filling layer comes into contact with a predetermined portion of said first wiring layer, said conductor film forming a second wiring layer on a second insulating layer comprising said insulating film;
• and
• compression-bonding said filling layer and said first wiring layer by heating a contact portion therebetween to a predetermined temperature, to form an alloy of said second metal and a metal forming said first wiring layer at a contact region between said filling layer and said first wiring layer.

A method of manufacturing a multilayered wiring structure, comprising:

• forming a conductor film made of a metal on an insulating film;
• forming a hole in said insulating film to expose said conductor film;
• forming a filling layer made of a first metal and a second metal covering said first metal to fill said hole;
• adhering said insulating film with said conductor film formed thereon to said substrate, said conductor film being located over the insulating film, such that said filling layer comes into contact with a predetermined portion of said metal substrate, said conductor film forming a wiring layer on an insulating layer comprising said insulating film;
• and
• compression-bonding said filling layer and said substrate by heating a contact portion therebetween to a predetermined temperature, thereby forming an alloy of said second metal and a metal forming said substrate at a contact region between said filling layer and said substrate.

A method of manufacturing a multilayered wiring structure comprising:

• forming a first insulating layer on a substrate;
• forming a first wiring layer on said first insulating layer;
• forming a second insulating layer on said first wiring layer;
• forming a conductor film made of a metal on said second insulating layer;
• forming a hole extending from said conductor film to said insulating film to expose a surface of said first wiring layer;
• forming a filling layer made of a first metal and a second metal covering said first metal to fill said hole from an exposed surface of said first wiring layer;
• patterning said conductor film to form a second wiring layer;
• and
• compression-bonding said filling layer and said second wiring layer by heating a filling layer and said second wiring layer by heating a contact portion there between to a predetermined temperature to form an alloy of said second metal and a metal forming said second wiring layer at a contact region between said filling layer and said second wiring layer.

A method of manufacturing a multilayered wiring structure, comprising:

• forming an insulating layer on a substrate;
• forming a conductor film on said insulating layer;
• forming a hole extending from said conductor film to said insulating film to expose a surface of said substrate;
• forming a filling layer made of a first metal and a second metal covering said first metal to fill said hole from an exposed surface of said substrate;
• patterning said conductor film to form a wiring layer;
• and
• compression-bonding said filling layer and said wiring layer by heating a contact portion therebetween to a predetermined temperature, to form an alloy of said second metal and a metal forming said wiring layer at a contact region between said filling layer and said wiring layer.