Method and apparatus providing redundancy for fabricating highly reliable memory modules
AssigneeMicron Technology, Inc.
InventorsSalman Akram, James M. Wark, David R. Hembree
Life of this patent
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Abstract
A method and apparatus for repair of a multi-chip module, such as a memory module, is provided where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.
Claims21
A method of constructing an electronic system, comprising:
- providing at least one memory device;
- providing at least one processor device;
- providing at least one repairable memory module including at least one substrate;
- providing a plurality of primary memory chip attach sites on the at least one substrate;
- providing at least one vacant auxiliaty memory chip attach site on the at least one substrate;
- and
- configuring the at least one vacant auxiliary memory chip attach site to accept a memory chip of at least two different sizes.
Dependencies are inferred from the claim text.