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US 6,274,389 B1Granted
Mounting structure and mounting process from semiconductor devices
AssigneesLoctite (R&D) Limited, Matsushita Electric Industrial Co., Ltd., Loctite Corporation
InventorsKazutoshi Iida, Jon Wigham, Masaki Watanabe, Takeshi Meguro
Life of this patent
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Abstract
The present invention provides a mounting structure for semiconductor devices which enables a semiconductor device, such as CSP/BGA, to be fixed to a circuit board. This invention also provides a mounting process for semiconductor devices.
Claims19
A mounting structure for semiconductor devices, comprising:
- a semiconductor device comprising a semiconductor chip mounted on a carrier substrate, and
- a circuit board to which said semiconductor device is electrically connected, wherein the space between the carrier substrate of said semiconductor device and said circuit board is sealed with a reaction product of a thermosetting resin composition comprising about 100 parts by weight of an epoxy resin, about 3 to about 60 parts by weight of a curing agent and about 1 to about 90 parts by weight of a plasticizer.
A process for semiconductor devices, said process comprising the steps of:
- electrically connecting a semiconductor device comprising a semiconductor chip mounted on a carrier substrate, to a circuit board;
- infiltrating a thermosetting resin composition into the space between the carrier substrate of said semiconductor device and said circuit board, wherein the composition Comprising about 100 parts by weight of an epoxy resin, about 3 to about 60 parts by weight of a curing agent and about 1 to about 90 parts by weight of a plasticizer, and
- curing the thermosetting resin composition by the application of heat.
Dependencies are inferred from the claim text.