Semiconductor encapsulating epoxy resin composition and semiconductor device
AssigneesHokko Chemical Industry Co., Ltd., Shin-Etsu Chemical Co., Ltd.
InventorsKenji Ohashi, Tatsuya Ishizaki, Masayuki Umeno, Eiichi Asano, Kazutoshi Tomiyoshi, Shoichi Osada, Toshio Shiobara
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Abstract
An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.
Claims12
An epoxy resin composition for semiconductor encapsulation comprising, in admixture,
- (A) an epoxy resin,
- (B) a phenolic resin curing agent,
- (C) a quaternary phosphorus compound of formula (1):
- wherein each R1 is independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, a is an integer of 1 to 3, and
- (D) an inorganic filler.
An epoxy resin composition for semiconductor encapsulation comprising, in admixture,
- (A) an epoxy resin,
- (B) a phenolic resin curing agent,
- (C′) a curing catalyst obtained by mixing at a temperature of 100 to 250° C. a phenolic resin having at least two phenolic hydroxyl groups in the molecule with a quaternary phosphorus compound of formula (1):
- wherein each R1 is independently an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, a is an integer of 1 to 3, and
- (D) an inorganic filler.
Dependencies are inferred from the claim text.