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US 6,274,245 B1Granted
Foil for use in filing substrate recesses
AssigneeTrikon Technologies Limited
InventorsChristopher David Dobson, Arthur John McGeown
Life of this patent
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Abstract
To fill a hole or trench structure in an article, such as a semiconductor wafer, a layer is formed on the article. The layer extends over the structure so as to seal the mouth thereof. The layer may be deposited by sputtering, etc, or the layer may be deposited as a pre-formed foil. Then, the wafer and layer are subject to elevated pressure and elevated temperature such as to cause material of the layer to flow into the structure.
Claims12
A foil comprising:
- a pre-fabricated body which is suitable for laying across a plurality of recesses on a semiconductor wafer and which is made of a highly conducting ductile metal which is deformable under pressure and heat to fill the plurality of recesses of the semiconductor wafer;
- and
- a carrier layer mounted to a principal surface of the pre-fabricated body which is to face away from the recesses.
A semiconductor intermediate product comprising:
- a wafer having a plurality of recesses in a surface thereof;
- a pre-fabricated foil which lays across the plurality of recesses on the surface of the semiconductor wafer and which is made of a highly conducting ductile material which is deformable under pressure and heat to fill the plurality of recesses of the semiconductor wafer;
- and
- a carrier layer mounted to a principal surface of the pre-fabricated body which is to face away from the recesses.
1 more element
Dependencies are inferred from the claim text.