Organometallic complex process for the preparation thereof and metal organic chemical vapor deposition using same
AssigneePostech Foundation
InventorsShi-Woo Rhee, Jae-Young Shim, Jung-Hyun Lee, Dae-Hwan Kim
Life of this patent
Estimating the term…
Abstract
An organometallic complex of formula(I) having a low evaporation temperature can be used as a precursor for the MOCVD of a metal compound thin film on semiconductor devices wherein, M is Ti or Zr; R1, R2, R3 and R4 are each independently H or C1-4 alkyl; and m is an integer ranging from 2 to 5.
Claims3
A process for depositing a metal oxide compound film on a substrate which comprises the steps of vaporizing the organometallic complex of formula (I) optionally together with one or more organometallic precursors, at a temperature ranging from 20 to 300° C. and bringing the resulting vapor into contact with the substrate heated to a temperature ranging from 300 to 600° C.:
- wherein,
- M is Ti or Zr;
- R1, R2, R3 and R4 are each independently H or C1-4 alkyl;
- and
- m is an integer ranging from 2 to 5.
Dependencies are inferred from the claim text.