Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
AssigneeHoneywell International Inc.
InventorsAnthony F. Beier, Janine K. Kardokus, Susan D. Strothers
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Abstract
Described is a method for producing a diffusion bonded sputtering assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
Claims17
A method of making a heat treated sputtering target assembly comprising:
- providing a backing plate for a sputtering target;
- providing a sputtering target;
- diffusion bonding the backing plate to the sputtering target to produce a sputtering target assembly;
- and
- heat treating the sputtering target assembly to precipitation harden the backing plate of the diffusion bonded sputtering target assembly by a process that includes heating, and quenching wherein said quenching is performed by immersing the backing plate in a quenchant without submerging the sputtering target.
A heat treated sputtering target assembly comprising a quenched precipitation hardened backing plate diffusion bonded to a sputtering target.
Dependencies are inferred from the claim text.