Piping system for etch equipment
AssigneeMosel Vitelic, Inc.
InventorsChia-Lin Yeh, Chi-Shu Huang, Ming-Yeng Wang, Jia-Rurng Hwu
Life of this patent
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Abstract
The present invention discloses a piping system for etch equipment including an exhaust gas tube connected with an etching chamber for conveying exhaust gas out of the chamber. A cooling gas tube connected to the etching chamber allows cooling gas to flow around a back side of the wafer placed in the chamber for cooling the wafer's temperature. A cooling gas bypass tube connected between the cooling gas tube and the exhaust gas tube is used for regulating a gas flow in the cooling gas tube. Moreover, a plurality of heaters are set out of conjunctions of the cooling gas tube and cooling gas bypass tube with the exhaust gas tube so as to retard particle accumulation in the conjunctions of these tubes.
Claims19
A piping system for etch equipment, the system comprising:
- a chamber for performing an etch process for a wafer;
- an exhaust gas tube connecting with the chamber for conveying exhaust gas out of the chamber;
- a cooling gas tube connecting to the chamber for conveying cooling gas flowing through a back side of the wafer thereby decreasing the wafer's temperature;
- a cooling gas bypass tube connecting between the cooling gas tube and the exhaust gas tube for regulating a flow of cooling gas in the cooling gas tube;
- and
- a heater located on a joint region between the cooling gas bypass tube and the exhaust gas tube for heating the joint region thereby preventing particles accumulating in the joint region.
A piping system for etch equipment, the system comprising:
- a chamber for performing an etch process for a wafer;
- an exhaust gas tube connecting with the chamber for conveying exhaust gas out of the chamber;
- a pump connecting to the exhaust gas tube for pumping the exhaust gas out of the chamber through the exhaust gas tube;
- a cooling gas tube connecting to the chamber for conveying cooling gas flowing through a back side of the wafer thereby decreasing the wafer's temperature;
- a cooling gas bypass tube connecting between the cooling gas tube and the exhaust gas tube for regulating a flow of cooling gas in the cooling gas tube;
- a ballast gas tube connected to an exhaust line at a point between the chamber and the pump for providing the pump ballast gas to adjust gas pressure and density in the pump;
- and
- heaters located on a joint region between the cooling gas bypass tube and the exhaust gas tube for heating the joint region thereby preventing particles accumulating in the joint region.
Dependencies are inferred from the claim text.