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US 6,273,806 B1Granted
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
AssigneeApplied Materials, Inc.
InventorsDoyle E. Bennett, Fred C. Redeker, Thomas H. Osterheld, Ginnetto Addiego
Life of this patent
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Abstract
A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of circular concentric grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
Claims16
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves with a first width and a first pitch;
- and
- a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves with a second width and a second pitch, wherein the second polishing region is an outermost concentric region of the polishing pad, and wherein the second pitch is less than the first pitch.
A polishing pad for polishing a substrate in a chemical mechanical polishing system, comprising:
- a first polishing region having a first plurality of substantially circular concentric grooves with a first width and a first pitch;
- a second polishing region surrounding the first polishing region and having a second plurality of substantially circular concentric grooves with a second width and a second pitch, wherein the first width is greater than the second width or the first pitch is less than the second pitch;
- and
- a third polishing region surrounding the second polishing region and having a third plurality of substantially circular concentric grooves with a third width and a third pitch, the third pitch and third width being substantially equal to the first pitch and first width, respectively.
1 more element
Dependencies are inferred from the claim text.